Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung Set to Accelerate HBM4 and HBM4E Production
Reported by Seo Jong-gap | Seoul Economic Daily Published: September 20, 2026
Samsung Electronics (005930) is preparing for a massive scale-up of its high-bandwidth memory (HBM) portfolio. Industry insiders indicate that the company intends to more than double the output of its HBM4 (6th generation) and HBM4E (7th generation) chips by next year.
🛠️ The Critical Role of Glass Carriers
A primary indicator of this production surge is the skyrocketing demand for glass carriers. These are specialized glass supports used to stabilize wafers during the thinning process of HBM DRAM.
Why are they necessary?
As Samsung pushes toward 12-layer stacks and higher, the physical constraints of the wafer become a challenge. Glass carriers are temporarily attached to the wafer's underside to ensure:
- Prevention of wafer bending (warpage)
- Protection against cracking during grinding
- Stability during the drilling process
The growth in outsourced cleaning volume for these carriers serves as a proxy for total production:
| Period | Monthly Glass Carrier Volume | Growth Factor |
|---|---|---|
| Last Year | 10,000 sheets | Base |
| This Year | 20,000 sheets | |
| Next Year (Est.) | 50,000 sheets |
"Even when accounting for the reuse of carriers after cleaning and variations in yield, a 2.5-fold increase in volume strongly suggests that HBM4 and HBM4E output will grow by at least 100% compared to this year." — Industry Analysts
📈 Production Forecasts & Product Mix
Samsung is not just increasing volume; it is shifting its focus toward high-value, next-generation memory.
Capacity Expansion
The total monthly wafer input for HBM is expected to rise significantly: This represents a total capacity growth of approximately .
Shift in Product Mix
The "HBM4 family" (including HBM4E) is expected to dominate the shipment ratio:
- Current Year: of total HBM shipments.
- Next Year: of total HBM shipments.
📅 Development Timeline
The ramp-up follows a series of strategic technical milestones achieved earlier this year:
Summary of Strategic Pivot
Samsung is effectively phasing out older generations prioritizing the HBM4 family to capture the high-end AI accelerator market. By integrating 1c DRAM and advanced base dies, they are positioning themselves to meet the rigorous demands of partners like Nvidia.
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